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S3P70F4
Part No
Manufacturer
Parts specification
Quantity
2371770
Part No
S3P70F4XZZ-C0C4-3PXRZB
Manufacturer
SAMSUNG
Parts specification
Quantity
5030
Price(USD)
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2371792
Part No
S3P70F4XZZ-AVB4
Manufacturer
SAMSUNG
Parts specification
Quantity
5047
Price(USD)
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2371827
Part No
S3P70F4XZZ-SO94
Manufacturer
SAMSUNG
Parts specification
Quantity
5073
Price(USD)
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2371832
Part No
S3P70F4XZZ-AV94
Manufacturer
SAMSUNG
Parts specification
Quantity
5077
Price(USD)
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2371843
Part No
S3P70F4XZZ-SOB4
Manufacturer
SAMSUNG
Parts specification
Quantity
5086
Price(USD)
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2371881
Part No
S3P70F4
Manufacturer
SAMSUNG
Parts specification
Quantity
5115
Price(USD)
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2371894
Part No
S3P70F4XZZ-C0C4
Manufacturer
SAMSUNG
Parts specification
Quantity
5125
Price(USD)
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2371903
Part No
S3P70F4XD8-AVB4
Manufacturer
SAMSUNG
Parts specification
Quantity
5132
Price(USD)
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2371955
Part No
S3P70F4XZZ-AU134
Manufacturer
SAMSUNG
Parts specification
Quantity
5172
Price(USD)
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2371965
Part No
S3P70F4X22-AVB4
Manufacturer
SAMSUNG
Parts specification
Quantity
5179
Price(USD)
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2371973
Part No
S3P70F4XZZ-S0B4
Manufacturer
SAMSUNG
Parts specification
Quantity
5186
Price(USD)
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2372012
Part No
S3P70F4XZZ-S094
Manufacturer
SAMSUNG
Parts specification
Quantity
5215
Price(USD)
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2372025
Part No
S3P70F4XZZ-5PJ
Manufacturer
SAMSUNG
Parts specification
Quantity
5225
Price(USD)
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2372130
Part No
S3P70F4XZZ-AV9
Manufacturer
SAMSUNG
Parts specification
Quantity
5306
Price(USD)
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2388909
Part No
S3P70F4XZZ-COC4
Manufacturer
SAMSUNG
Parts specification
Quantity
6672
Price(USD)
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2388910
Part No
S3P70F4XZZ-SO98
Manufacturer
SAMSUNG
Parts specification
Quantity
6673
Price(USD)
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2388911
Part No
S3P70F4XC4-AV84
Manufacturer
SAMSUNG
Parts specification
Quantity
6673
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XCZU2CG-1SBCVJ478E
Manufacturer
:
XILINX
Part No
:
XCZU2CG-1SBVA484E
Order Code
:
2760177
Product Range
:
Zynq UltraScale+ MPSoC Family
Series
:
MPSoC
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Product Overview
The Xilinx Zynq® UltraScale+™ MPSoC family provide 64bit processor scalability while combining real-time control with soft, hard engines for graphics, video, waveform and packet processing. Built on a common real-time processor and programmable logic equipped platform, 3 distinct variants include dual (CG), quad application processor and GPU (EG) and video codec (EV) devices, creating unlimited possibilities for 5G wireless, next generation ADAS, industrial IoT applications. The CG devices hasheterogeneous processing system comprised of dual-core Cortex™-A53, dual-core Cortex™-R5 real-timeprocessing unit.
- Zynq® UltraScale+™ MPSoCs are available in -3, -2, -1 speed grades
- Innovative ARM® + FPGA architecture for differentiation, analytics & control
- Extensive OS, middleware, stacks, accelerators and IP ecosystem
- Multiple levels of hardware and software security, architected to deliver low system power
- Integration delivering the de facto All Programmable platform
- Up to 5X system level performance per watt over Zynq®-7000 SoCs
- Industry leading design tools, C/C++, open CL design abstractions
S3P70F4
Manufacturer
:
SAMSUNG
Part No
:
S3P70F4
Qty
:
5115
Product Category
:
-
Series
:
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Product Overview